Plasma Etch Controller Skill

Plasma Etch Controller

Purpose

The Plasma Etch Controller skill provides comprehensive plasma etching process control for nanofabrication, enabling anisotropic pattern transfer with optimized selectivity, profile control, and minimal damage.

Capabilities

Etch chemistry selection
Anisotropy and selectivity optimization
Endpoint detection
Profile and sidewall angle control
Loading effect compensation
Plasma damage assessment

Usage Guidelines

Plasma Etch Process

Chemistry Selection
- Match chemistry to material
- Consider selectivity requirements
- Address sidewall passivation
Profile Control
- Optimize ion energy
- Balance chemical and physical
- Control sidewall angle
Endpoint Detection
- Use OES for species monitoring
- Apply interferometry
- Implement time-based backup

Process Integration

Nanolithography Process Development
Nanodevice Integration Process Flow

Input Schema

{
  "material": "string",
  "mask_type": "string",
  "target_depth": "number (nm)",
  "feature_cd": "number (nm)",
  "selectivity_requirements": {
    "to_mask": "number",
    "to_underlayer": "number"
  }
}

Output Schema

{
  "etch_recipe": {
    "gases": [{"gas": "string", "flow": "number (sccm)"}],
    "pressure": "number (mTorr)",
    "rf_power": "number (W)",
    "bias_power": "number (W)"
  },
  "etch_rate": "number (nm/min)",
  "selectivity": {
    "to_mask": "number",
    "to_underlayer": "number"
  },
  "sidewall_angle": "number (degrees)",
  "uniformity": "number (%)"
}

Agent Skills: Plasma Etch Controller

Install this agent skill to your local

Skill Files